发明名称 |
PLANAR ANTENNA |
摘要 |
A plane antenna device includes a multi-layered dielectric substrate having a plurality of dielectric layers; a first conductive plane on or in the multi-layered dielectric substrate; a second conductive plane on or in the multi-layered dielectric substrate, wherein at least first and second dielectric layers of the plurality of dielectric layers are disposed between the first and second conductive planes; a first signal line being between the at least first and second dielectric layers, the first signal line being between the first conductive plane and the second conductive plane; a first conductive via in the first dielectric layer, the first conductive via being distanced from the first signal line; and a second conductive via in the second dielectric layer, the second conductive via being distanced from the first signal line, the second conductive via being aligned to the first conductive via. |
申请公布号 |
US2017054217(A1) |
申请公布日期 |
2017.02.23 |
申请号 |
US201615239173 |
申请日期 |
2016.08.17 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HASHIMOTO Koh;HIGAKI Makoto;MUKAI Manabu |
分类号 |
H01Q9/28;H01Q1/38 |
主分类号 |
H01Q9/28 |
代理机构 |
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代理人 |
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主权项 |
1. A plane antenna device comprising:
a multi-layered dielectric substrate having a plurality of dielectric layers; a first conductive plane on or in the multilayered dielectric substrate; a second conductive plane on or in the multi-layered dielectric substrate, wherein at least first and second dielectric layers of the plurality of dielectric layers are disposed between the first and second conductive planes; a first signal line being between the at least first and second dielectric layers, the first signal line being between the first conductive plane and the second conductive plane; a first conductive via in the first dielectric layer, the first conductive via being distanced from the first signal line; and a second conductive via in the second dielectric layer, the second conductive via being distanced from the first signal line, the second conductive via being aligned to the first conductive via. |
地址 |
Tokyo JP |