发明名称 |
Non-Planar Quantum Well Device Having Interfacial Layer and Method of Forming Same |
摘要 |
Techniques are disclosed for forming a non-planar quantum well structure. In particular, the quantum well structure can be implemented with group IV or III-V semiconductor materials and includes a fin structure. In one example case, a non-planar quantum well device is provided, which includes a quantum well structure having a substrate (e.g. SiGe or GaAs buffer on silicon), a IV or III-V material barrier layer (e.g., SiGe or GaAs or AlGaAs), and a quantum well layer. A fin structure is formed in the quantum well structure, and an interfacial layer provided over the fin structure. A gate metal can be deposited across the fin structure. Drain/source regions can be formed at respective ends of the fin structure. |
申请公布号 |
US2017054026(A1) |
申请公布日期 |
2017.02.23 |
申请号 |
US201615345546 |
申请日期 |
2016.11.08 |
申请人 |
Intel Corporation |
发明人 |
Rachmady Willy;Pillarisetty Ravi;Le Van H.;Chau Robert S. |
分类号 |
H01L29/78;H01L29/165;H01L29/06;H01L29/12;H01L29/10;H01L21/762;H01L21/306;H01L29/66 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a non-planar quantum well structure, comprising:
providing a quantum well structure including a substrate and a quantum well layer that includes a channel region; selectively etching the quantum well structure to form a fin structure that is: (a) formed in the quantum well structure, and (b) includes the quantum well layer; providing a dielectric layer over the fin structure; and providing gate metal over the dielectric layer. |
地址 |
Santa Clara CA US |