发明名称 DISLOCATION STRESS MEMORIZATION TECHNIQUE (DSMT) ON EPITAXIAL CHANNEL DEVICES
摘要 The present disclosure relates to a transistor device having epitaxial source and drain regions with dislocation stress memorization (DSM) regions that provide stress to a channel region. In some embodiments, the transistor device has an epitaxial source region arranged within a substrate. An epitaxial drain region is arranged within the substrate and is separated from the epitaxial source region by a channel region. A first DSM region, which has a stressed lattice configured to generate stress within the channel region, extends from below the epitaxial source region to a location within the epitaxial source region. A second DSM region, which has a stressed lattice configured to generate stress within the channel region, extends from below the epitaxial drain region to a location within the epitaxial drain region.
申请公布号 US2017054022(A1) 申请公布日期 2017.02.23
申请号 US201615345814 申请日期 2016.11.08
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Yu Tsung-Hsing;Huang Shih-Syuan;Sheu Yi-Ming;Goto Ken-Ichi
分类号 H01L29/78;H01L29/10;H01L29/66;H01L29/167;H01L29/417;H01L21/265;H01L29/16 主分类号 H01L29/78
代理机构 代理人
主权项 1. A transistor device, comprising: an epitaxial source region arranged within a substrate; an epitaxial drain region arranged within the substrate and separated from the epitaxial source region by a channel region; and first and second dislocation stress memorization (DSM) regions comprising stressed lattices configured to generate stress within the channel region, wherein the first DSM region extends from below the epitaxial source region to a first location within the epitaxial source region and the second DSM region extends from below the epitaxial drain region to a second location within the epitaxial drain region.
地址 Hsin-Chu TW