| 摘要 |
A method for decontaminating support surfaces of a wafer chuck entails lightly passing a treatment tool having a nominally flat contacting surface over the regions of the chuck where contaminants are to be removed. The treatment tool and the chuck surface may have about the same hardness. The treatment tool may be constrained so that it may conform to the surface being processed. When the treatment tool is contacted to a flat surface, the area of contact may be in the form of a circle, ring or annulus. At application pressures, the treatment tool will abrade the chuck, which here is to be avoided, or at least minimized. Thus, the instant inventors have discovered that the same treatment tool that is used to engineer the elevation profile of the surface, and its roughness, at lower application pressures can be used to remove grinding debris and other contaminants from the surface. |
