HEAT-DISSIPATING DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A heat-dissipating device includes a base and a plurality of heat-dissipating members. The base is formed with a plurality of joint holes. Each heat-dissipating member has an inserting section and an exposed section connected with the inserting section. The inserting sections are inserted into the joint holes in a close fit manner, respectively. The exposed sections are exposed outside a top surface of the base. The ends of the inserting sections and the bottom surface of the base are welded by a friction stir welding (FSW) manner with a solid-state joining structure. The present disclosure also provides a method for manufacturing a heat-dissipating device, which joins the ends of the inserting sections and the bottom surface of the base by a friction stir welding manner.

主权项

1. A heat-dissipating device, comprising:
a base, formed with a plurality of joint holes; and a plurality of heat-dissipating members, each heat-dissipating member has an inserting section and an exposed section connected with the inserting section, the inserting sections inserted in the joint holes in a close fit manner, the exposed sections exposed outside the top surface of the base, wherein the bottom ends of the inserting sections and the bottom surface of the base are joined by a friction stir welding process so as to form a solid-state joining structure without tin solder.