| 摘要 |
The purpose of the present invention is to provide: a novolac-type phenolic hydroxy group-containing resin having excellent developability, heat resistance and dry etching resistance; and a resist film. A novolac-type phenolic hydroxy group-containing resin characterized by having, as a repeating unit, a structural moiety (I) represented by structural formula (1) [wherein Ar represents an arylene group; R1's independently represent any one of a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group and a halogen atom; and m's independently represent an integer of 1 to 3] or a structural moiety (II) represented by structural formula (2) [wherein Ar represents an arylene group; R1's independently represent any one of a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group and a halogen atom; and m's independently represent an integer of 1 to 3]. |
