发明名称 STRAINED FINFET DEVICE FABRICATION
摘要 A method for forming a fin on a substrate comprises patterning and etching a layer of a first semiconductor material to define a strained fin, depositing a layer of a second semiconductor material over the fin, the second semiconductor material operative to maintain the a strain in the strained fin, etching to remove a portion of the second semiconductor material to define a cavity that exposes a portion of the fin, etching to remove the exposed portion of the fin such that the fin is divided into a first segment and a second segment, and depositing an insulator material in the cavity, the insulator material contacting the first segment of the fin and the second segment of the fin.
申请公布号 US2017053942(A1) 申请公布日期 2017.02.23
申请号 US201514833356 申请日期 2015.08.24
申请人 International Business Machines Corporation 发明人 Doris Bruce B.;He Hong;Kanakasabapathy Sivananda K.;Karve Gauri;Lie Fee Li;Sieg Stuart A.
分类号 H01L27/12;H01L29/16;H01L29/06;H01L29/161;H01L29/78 主分类号 H01L27/12
代理机构 代理人
主权项 1. A field effect transistor device comprising: a first semiconductor fin having a first distal end and a second distal end arranged on a substrate; a second semiconductor fin having a first distal end and a second distal end arranged on the substrate, the second semiconductor fin and the first semiconductor fin having a common longitudinal axis; an insulator material disposed between and in contact with the first distal end of the first semiconductor fin and the first distal end of the second semiconductor fin such that the insulator material exerts a tensile force on the first distal end of the first semiconductor fin and the first distal end of the second semiconductor fin; and a semiconductor layer arranged over an entirety of a longitudinal length of the first semiconductor fin.
地址 Armonk NY US