PRESSURE-SENSITIVE ADHESIVE COMPOSITION

摘要

Provided are a pressure-sensitive adhesive composition, an encapsulation film including the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the pressure-sensitive adhesive composition, which can form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.

主权项

1. A pressure-sensitive adhesive composition, comprising:
a polymer derived from butylene; and a compound satisfying Formula 1, where T is a linear or branched alkyl group, alkenyl group or alkynyl group having 6 to 30 carbon atoms, or —U—[O—W]—O-Q, in which U and W are each independently an alkylene group or alkylidene group, Q is an alkyl group, alkenyl group, alkynyl group or aryl group, and n is a number from 0 to 10.