| 发明名称 |
WAFER PROCESSING METHOD |
| 摘要 |
A wafer processing method of processing a wafer with a plurality of devices disposed in areas demarcated by projected division lines and formed on a face side thereof includes a protective member placing step of placing a protective member for protecting the face side of the wafer on the face side of the wafer which is divided into individual device chips, a resin laying step of laying a die-bonding resin on the reverse sides of the individual device chips by applying a die-bonding liquid resin on the reverse side of the wafer and hardening the applied die-bonding liquid resin, and a separation step of separating the device chips with the die-bonding liquid resin laid on the reverse sides thereof from the wafer. |
| 申请公布号 |
US2017053830(A1) |
申请公布日期 |
2017.02.23 |
| 申请号 |
US201615234587 |
申请日期 |
2016.08.11 |
| 申请人 |
DISCO CORPORATION |
发明人 |
Haimoto Takashi;Koshimizu Hideki;Araya Yurika;Sugiya Tetsukazu |
| 分类号 |
H01L21/78;H01L21/268;H01L21/306;H01L21/304;H01L23/544;H01L21/683 |
主分类号 |
H01L21/78 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer processing method of processing a wafer with a plurality of devices formed in areas demarcated by projected division lines on a face side thereof, comprising:
a protective member placing step of placing a protective member for protecting the face side of the wafer on the face side of the wafer which is divided into individual device chips; a resin laying step of laying a die-bonding resin on the reverse sides of the individual device chips by applying a die-bonding liquid resin on the reverse side of the wafer and hardening the applied die-bonding liquid resin; and a separating step of separating the device chips with the die-bonding liquid resin laid on the reverse sides thereof from the wafer. |
| 地址 |
Tokyo JP |
