| 发明名称 |
HYBRID FABRICATION METHOD FOR LARGE AREA MICROWAVE CIRCUITS |
| 摘要 |
A microwave device can include a printed circuit board substrate having a first microwave device subcircuit and a microdevice substrate having a second microwave device subcircuit. The first microwave device subcircuit may be formed at a low resolution and a low tolerance, while the second microwave device subcircuit may be formed at a high resolution and a high tolerance. The first microwave device subcircuit and the second microwave device subcircuit may be electrically coupled using a conductor. |
| 申请公布号 |
US2017055342(A1) |
申请公布日期 |
2017.02.23 |
| 申请号 |
US201514832462 |
申请日期 |
2015.08.21 |
| 申请人 |
The Boeing Company |
发明人 |
Lam Tai Anh;Nielsen Jean Ann;Tanielian Minas H. |
| 分类号 |
H05K1/02;H05K1/11;H05K3/12;H05K3/40;H05K3/04;H05K3/06;H05K1/18;H05K3/30 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A microwave device, comprising:
a printed circuit board structure, comprising:
a printed circuit board substrate having a circuit side; anda first microwave device subcircuit on the circuit side of the printed circuit board substrate; a passive microwave microdevice, comprising:
a microdevice substrate having a passive layer side; anda second microwave device subcircuit on the passive layer side of the microdevice substrate; and an electrical conductor that electrically couples the first microwave device subcircuit to the second microwave device subcircuit. |
| 地址 |
Chicago IL US |
