发明名称 COMPOSITE MATERIAL, PHOTOSENSITIVE RESIN COMPOSITION FOR SOLDER RESIST, AND PHOTOSENSITIVE ELEMENT
摘要 Disclosed is a composite material provided with a metal material and a protective member which is a cured curable resin composition provided on a surface of the metal material. The curable resin composition contains radical-polymerizable monomers including a first monofunctional radical-polymerizable monomer and a second monofunctional radical-polymerizable monomer. The first monofunctional radical-polymerizable monomer is a monomer for forming a homopolymer having a glass transition temperature of 20°C or lower when polymerized independently. The second monofunctional radical-polymerizable monomer is a monomer for forming a homopolymer having a glass transition temperature of 50°C or above when polymerized independently.
申请公布号 WO2017030099(A1) 申请公布日期 2017.02.23
申请号 WO2016JP73792 申请日期 2016.08.12
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 TAKEUCHI Kazumasa;YOKOYAMA Kosuke;SHIRASAKA Toshiaki;OCHIAI Bungo;CHIBA Kazuki;KIRYU Tomonari
分类号 C08F2/44;C08F220/18;C08J5/00;C08L33/10 主分类号 C08F2/44
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