发明名称 |
COMPOSITE MATERIAL, PHOTOSENSITIVE RESIN COMPOSITION FOR SOLDER RESIST, AND PHOTOSENSITIVE ELEMENT |
摘要 |
Disclosed is a composite material provided with a metal material and a protective member which is a cured curable resin composition provided on a surface of the metal material. The curable resin composition contains radical-polymerizable monomers including a first monofunctional radical-polymerizable monomer and a second monofunctional radical-polymerizable monomer. The first monofunctional radical-polymerizable monomer is a monomer for forming a homopolymer having a glass transition temperature of 20°C or lower when polymerized independently. The second monofunctional radical-polymerizable monomer is a monomer for forming a homopolymer having a glass transition temperature of 50°C or above when polymerized independently. |
申请公布号 |
WO2017030099(A1) |
申请公布日期 |
2017.02.23 |
申请号 |
WO2016JP73792 |
申请日期 |
2016.08.12 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TAKEUCHI Kazumasa;YOKOYAMA Kosuke;SHIRASAKA Toshiaki;OCHIAI Bungo;CHIBA Kazuki;KIRYU Tomonari |
分类号 |
C08F2/44;C08F220/18;C08J5/00;C08L33/10 |
主分类号 |
C08F2/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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