UNPACKED STRUCTURE FOR POWER DEVICE OF RADIO FREQUENCY POWER AMPLIFICATION MODULE AND ASSEMBLY METHOD THEREFOR

摘要

A power device without a package structure in a radio frequency power amplifier module and an assembly method for a radio frequency power amplifier module are provided. The radio frequency power amplification module includes the power device, a heat dissipating plate and a printed circuit board. The power device includes a carrier flange, a plurality of electronic elements and bond-wires, and the electronic elements are adhered to the carrier flange, the power device and the printed circuit board are fixed on the heat dissipating plate, the electronic elements of the power device are connected with each other through the bond-wires, and the electronic elements are directly connected to the printed circuit board through the bond-wires. The electronic elements include at least one passive device, a decoupling capacitor is disposed on the printed circuit board, and the decoupling capacitor is connected to the passive device through the bond-wires.

主权项

1. A power device without a package structure in a radio frequency power amplifier module, wherein the radio frequency power amplifier module comprises the power device, a heat dissipating plate and a printed circuit board,
wherein the printed circuit board has an opening and the printed circuit board with the opening is fixed on the heat dissipating plate, the power device comprises a carrier flange, a plurality of electronic elements and bond-wires, the electronic elements are adhered to the carrier flange, and the carrier flange adhered with the electronic elements is embedded into the opening of the printed circuit board and fixed on the heat dissipating plate, the electronic elements of the power device are connected with each other through the bond-wires, the electronic elements are directly connected to the printed circuit board through the bond-wires, and the electronic elements comprise at least one passive device; and a decoupling capacitor is disposed on the printed circuit board, and the decoupling capacitor is connected to the passive device through the bond-wires to form a decouple circuit.