发明名称 LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE
摘要 A light emitting device includes a package, at least one light emitting element, a light-transmissive resin, and a light reflecting resin. The package has a recess which includes a bottom surface and an inner peripheral surface. The bottom surface includes a light emitting element mounting region and a groove. The groove has an inner peripheral edge and an outer peripheral edge on the bottom surface to define the groove between the inner peripheral edge and the outer peripheral edge. The at least one light emitting element is mounted on the light emitting element mounting region. The light-transmissive resin is provided in the recess to cover the at least one light emitting element and to be in contact with the groove. The light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin to reach the outer peripheral edge of the groove.
申请公布号 US2017054061(A1) 申请公布日期 2017.02.23
申请号 US201615241075 申请日期 2016.08.19
申请人 NICHIA CORPORATION 发明人 NAKA Ryoji;BANDO Atsushi;MIKI Tomohide;MIYAMOTO Kimihiro
分类号 H01L33/56;H01L33/08;H01L33/62;H01L33/48;H01L33/60 主分类号 H01L33/56
代理机构 代理人
主权项 1. A light emitting device comprising: a package having a recess which includes a bottom surface and an inner peripheral surface around a periphery of the bottom surface, the bottom surface including a light emitting element mounting region and a groove surrounding the light emitting element mounting region, the groove having an inner peripheral edge and an outer peripheral edge on the bottom surface to define the groove between the inner peripheral edge and the outer peripheral edge; at least one light emitting element mounted on the light emitting element mounting region; a light-transmissive resin provided in the recess to cover the at least one light emitting element and to be in contact with the groove; and a light reflecting resin provided between the inner peripheral surface of the recess and the light-transmissive resin to reach the outer peripheral edge of the groove.
地址 Anan-shi JP
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