发明名称 SEMICONDUCTIVE DEVICE WITH A SINGLE DIFFUSION BREAK AND METHOD OF FABRICATING THE SAME
摘要 A method of fabricating a single diffusion break includes providing a fin with two gate structures crossing the fin and a middle dummy gate structure crossing the fin, wherein the middle dummy gate structure is sandwiched by the gate structures. Later, numerous spacers are formed and each spacer respectively surrounds the gate structures and the middle dummy gate structure. Then, the middle dummy gate structure, and part of the fin directly under the middle dummy gate structure are removed to form a recess. Finally, an isolating layer in the recess is formed to close an entrance of the recess so as to form a void embedded within the recess.
申请公布号 US2017053980(A1) 申请公布日期 2017.02.23
申请号 US201514830756 申请日期 2015.08.20
申请人 UNITED MICROELECTRONICS CORP. 发明人 Liou En-Chiuan;Yang Chih-Wei;Tung Yu-Cheng;Tseng Chia-Hsun
分类号 H01L29/06;H01L21/762;H01L21/311;H01L27/088;H01L29/66;H01L21/8234 主分类号 H01L29/06
代理机构 代理人
主权项 1. A method of fabricating a single diffusion break, comprising providing a fin with two gate structures crossing the fin and a middle dummy gate structure crossing the fin, wherein the middle dummy gate structure is sandwiched by the gate structures; forming a plurality of spacers, each spacer respectively surrounding the gate structures and the middle dummy gate structure; removing the middle dummy gate structure and part of the fin directly under the middle dummy gate structure to form a recess; and forming an isolating layer in the recess to close an entrance of the recess so as to form a void embedded within the recess, wherein a part of the void is higher than a top surface of the fin.
地址 Hsin-Chu City TW