SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND MOVING BODY

摘要

A semiconductor apparatus includes elements formed on a substrate, a first insulation layer, a first pad and a second pad arranged on the first insulation layer and located above the elements, and a second insulation layer that is arranged on the side surfaces and upper surfaces of the first pad and the second pad. The second insulation layer includes openings at upper surfaces of the first pad and the second pad. The thickness of the first pad and the second pad is 2 μm or more, the thickness of the second insulation layer is less than or equal to ⅖ of the thickness of the first pad and the second pad, and the distance between the first pad and the second pad is greater than or equal to four times the thickness of the first pad and the second pad.

主权项

1. A semiconductor apparatus comprising:
a substrate; an element arranged on the substrate; a first insulation layer arranged on the element and the substrate; a first pad arranged on the first insulation layer and located above the element; a second pad arranged on the first insulation layer; and a second insulation layer arranged on the first insulation layer, on a side surface and an upper surface of the first pad, and on a side surface and an upper surface of the second pad, wherein the second insulation layer includes an opening located at the upper surface of the first pad and an opening located at the upper surface of the second pad, the first pad and the second pad each have a thickness of 2 μm or more, the second insulation layer has a thickness that is less than or equal to ⅖ of the thickness of the first pad and the second pad, and a distance between the first pad and the second pad is greater than or equal to four times the thickness of the first pad and the second pad.