PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

摘要

A printed wiring board includes a build-up layer including insulating and conductor layers, pads formed on surface of the build-up layer and including first pads to connect an electronic component and second pads to connect an external wiring board onto the surface of the build-up layer, a mold resin layer formed on the surface of the build-up layer such that the mold layer is covering the surface of the build-up layer and has a cavity exposing the first pads and openings exposing the second pads, and conductor posts formed in the openings and including plating material such that the posts are connected to the second pads. The plating material of the posts includes electroless plating layer and electrolytic plating layer, and the posts are formed such that each post has an end surface exposed from surface of the mold layer on the opposite side with respect to the second pads.

主权项

1. A printed wiring board, comprising:
a build-up wiring layer comprising a resin insulating layer and a conductor layer; a plurality of pads formed on a first surface of the build-up wiring layer and comprising a plurality of first pads and a plurality of second pads such that the first pads are positioned to connect an electronic component onto the first surface of the build-up wiring layer and the second pads are positioned to connect an external wiring board onto the first surface of the build-up wiring layer; a mold resin layer formed on the first surface of the build-up wiring layer such that the mold resin layer is covering the first surface of the build-up wiring layer and has a cavity portion exposing the plurality of first pads and a plurality of opening portions exposing the plurality of second pads, respectively; and a plurality of conductor posts formed in the plurality of opening portions of the mold resin layer respectively and comprising plating material such that the plurality of conductor posts is connected to the plurality of second pads, respectively, wherein the plating material of the plurality of conductor posts comprises an electroless plating layer and an electrolytic plating layer, and the plurality of conductor posts is formed such that each of the conductor posts has an end surface exposed from a surface of the mold resin layer on an opposite side with respect to the second pads.