| 发明名称 |
SUBSTRATE ON SUBSTRATE PACKAGE |
| 摘要 |
Embodiments herein may relate to a patch on interposer (PoINT) architecture. In embodiments, the PoINT architecture may include a plurality of solder joints between a patch and an interposer. The solder joints may include a relatively high temperature solder ball and a relatively low temperature solder paste that at least partially surrounds the solder ball. Other embodiments may be described and/or claimed. |
| 申请公布号 |
US2017053858(A1) |
申请公布日期 |
2017.02.23 |
| 申请号 |
US201514831528 |
申请日期 |
2015.08.20 |
| 申请人 |
INTEL CORPORATION |
发明人 |
Krajniak Jan;Deppisch Carl L.;Mirpuri Kabirkumar J.;Jiang Hongjin;Hua Fay;Wei Yuying;Canham Beverly J.;Lu Jiongxin;Renavikar Mukul P. |
| 分类号 |
H01L23/498;B23K1/20;B23K35/02;H01L21/48;B23K35/26;B23K35/30;H01L23/00;B23K1/00;B23K35/36 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a first substrate with a first side and a second side opposite the first side; a second substrate with a first side and a second side opposite the first side, wherein the first substrate and second substrate define a space between the first side of the first substrate and the first side of the second substrate; a solder ball disposed within the space and physically coupled with the first side of the first substrate and the first side of the second substrate; and a solder paste positioned within the space and physically coupled with the solder ball, the first side of the first substrate, and the first side of the second substrate, wherein the solder paste partially surrounds the solder ball while the solder ball is partially exposed. |
| 地址 |
SANTA CLARA CA US |
