发明名称 |
MULTI-LAYER FORMS AND METHODS OF MANUFACTURING THE SAME |
摘要 |
Multi-layer forms and methods of producing the same are disclosed. An example apparatus includes means for moving a first substrate in a direction; means for applying adhesive to a first portion of a first side of the first substrate; means for mating a second substrate with the first portion; means for applying adhesive to a third portion of a second side of the first substrate; means for folding the first substrate about a first fold line to couple the third portion to a fourth portion of the second side; means for applying adhesive to a first sub-portion of a second portion of the first side; and means for folding the first substrate and the second substrate about a second fold line to couple a face of the first sub-portion and a face of a second sub-portion of the second portion and to position the first substrate between the second substrate. |
申请公布号 |
US2017050410(A1) |
申请公布日期 |
2017.02.23 |
申请号 |
US201615333165 |
申请日期 |
2016.10.24 |
申请人 |
R.R. Donnelley & Sons Company |
发明人 |
Johnson Joshua;Baeten Lynn;Wood Eric M.;Pulley Kevin |
分类号 |
B32B3/30;B32B27/10;B32B37/02;B32B37/12;B42D25/47;B32B38/06;B32B27/36;B32B27/30;B42D25/425;B32B3/26;B32B38/00 |
主分类号 |
B32B3/30 |
代理机构 |
|
代理人 |
|
主权项 |
1. An apparatus, comprising:
means for moving a first substrate in a direction, the first substrate comprising a first side opposite a second side, the first side having a first portion and a second portion, the second portion having a first sub-portion and a second sub-portion, the second side having a third portion and a fourth portion; means for applying adhesive to the first portion of the first side; means for mating a second substrate with the first portion of the first side; means for applying adhesive to the third portion of the second side; means for folding the first substrate about a first fold line to couple the third portion to the fourth portion; means for applying adhesive to the first sub-portion of the second portion; and means for folding the first substrate and the second substrate about a second fold line to couple a face of the first sub-portion and a face of the second sub-portion and to position the first substrate between the second substrate. |
地址 |
Chicago IL US |