| 摘要 |
There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate A semiconductor module (30) includes: a plurality of wiring patterns (33a) to (33d) formed on an insulating layer (32); a bare-chip transistor (35) mounted on one wiring pattern (33a) out of the plurality of wiring patterns (33a) to (33d) via a solder (34a); and a copper connector (36a), (36b) constituted of a copper plate for jointing an electrode (S), (G) formed on a top surface of the bare-chip transistor (35) and another wiring pattern (33b), (33c) out of the plurality of wiring patterns (33a) to (33d) via a solder (34a), (34c). |
