发明名称 ワーク剥離装置および剥離方法
摘要 PROBLEM TO BE SOLVED: To provide a workpiece release device capable of releasing a workpiece in a carrier hole of a work carrier surely in spite of an inexpensive and simple structure, and a release method for surely releasing the workpiece by using the workpiece release device.SOLUTION: The workpiece release device for releasing a workpiece in a carrier hole of a work carrier disposed on a lower mold platen of a polishing device is configured so that a suction pad 122 of a robot hand 12 sucks the workpiece directly on the workpiece where a transfer robot 11 is fitted to the carrier hole, and a fluid injection device 123 injects water for releasing the workpiece. The release method using the workpiece release device is also provided.
申请公布号 JP6083749(B2) 申请公布日期 2017.02.22
申请号 JP20130142490 申请日期 2013.07.08
申请人 浜井産業株式会社 发明人 佐藤 友章;小林 彰
分类号 B24B37/34;B24B41/06;H01L21/304 主分类号 B24B37/34
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