| 摘要 |
PROBLEM TO BE SOLVED: To provide a lighting device which achieves thickness reduction.SOLUTION: A lighting device 100 includes: a fixing plate 10 having a rectangular shape; a frame part 20 provided at a periphery of the fixing plate 10; a penetration plate 30 which faces the fixing plate 10 and fits into the frame part 20; LED chips 40 which are directly mounted on the fixing plate 10 and serve as semiconductor light emitting elements; and the likes. A wiring pattern is formed on one surface of the fixing plate 10. The multiple LED chips 40 are mounted on the one surface of the fixing plate 10 where the wiring pattern is formed. A heat radiation part 11 is provided on the other surface of the fixing plate 10. |
