发明名称 電子部品の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component whose productivity can be improved by performing alignment only in one direction when printing a conductive film serving as an internal electrode of the electronic component.SOLUTION: A method for manufacturing an electronic component comprises the steps of: forming a first ceramic green sheet on a carrier film; forming a first belt-like internal electrode on the first ceramic green sheet; forming a second ceramic green sheet on the first internal electrode; and forming a second belt-like internal electrode on the second ceramic green sheet on the basis of the location of the first internal electrode. The method further includes the steps of: forming a laminate; forming a first exposed surface by cutting the laminate along a width direction of the first and second internal electrodes; and forming a second exposed surface by cutting the laminate along a longitudinal direction of the first and second internal electrodes. In addition, the method includes a step of forming a chip-like laminate and forming a cover layer on the first exposed surface.
申请公布号 JP6083126(B2) 申请公布日期 2017.02.22
申请号 JP20120087784 申请日期 2012.04.06
申请人 株式会社村田製作所 发明人 高島 浩嘉;堂岡 稔;天谷 和広
分类号 H01G4/30;H01G4/12;H01G13/00 主分类号 H01G4/30
代理机构 代理人
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