SEMICONDUCTOR CHIP PACKAGE ASSEMBLY WITH IMPROVED HEAT DISSIPATION PERFORMANCE

摘要

A semiconductor chip package assembly (1) includes a package substrate (200) having a chip mounting surface (200a); a plurality of solder pads (212) disposed on the chip mounting surface; a first dummy pad (211) and a second dummy pad (211) spaced apart from the first dummy pad disposed on the chip mounting surface; a solder mask (202) on the chip mounting surface and partially covering the solder pads, the first dummy pad, and the second dummy pad; a chip package (100) mounted on the chip mounting surface and electrically connected to the package substrate through a plurality of solder balls (250) on respective said solder pads (212); a discrete device (150)having a first terminal (151) and a second terminal (152) disposed between the chip package and the package substrate; a first solder (154) connecting the first terminal with the first dummy pad (211) and the chip package (100); and a second solder (154) connecting the second terminal (152) with the second dummy pad (211) and the chip package (100).