LOW-FLYING HEIGHT IN-PLANE MAGNETIC IMAGE RECOGNITION SENSOR CHIP

摘要

Disclosed is a low fly height in-plane magnetic image sensor chip. This sensor chip comprises a Si substrate (1) with a pit (2) on the surface (4), a magnetoresistive sensor (5), and an insulating layer (6). The magnetoresistive sensor (5) is located on the bottom surface (3) of the pit (2) in the Si substrate (1). The insulating layer (6) is located above the magnetoresistive sensor (5). The magnetic image surface detected during operation is coplaner or parallel with the surface of the Si substrate (1) surface (3). The input and output ends of the magnetoresistive sensor (5) are connected with leads directly, or bonded with leads through pads (7(2)), or through a conducting post (8) and pads (7(2)) to form connections. And the flying height of the leads is lower than the height of the surface (4) of the Si substrate (1). This technical solution has several advantages, such as compact structure, high output signal, and direct contact with the magnetic image.