发明名称 物理量センサの製造方法
摘要 PROBLEM TO BE SOLVED: To simultaneously form, by etching without damaging a wiring layer, an engaging hole engaged with a sealing member and a penetration electrode hole into which a penetration electrode is inserted.SOLUTION: A penetration electrode hole 75a and engaging hole 76 are simultaneously formed by etching after a sensor chip 20b is provided with a mask 60 in which the dimension B of the narrowest portion of the engaging hole opening 62 is made smaller than the dimension A of the narrowest portion of the electrode hole opening 61. In this method, the depth b of the engaging hole 76 becomes less than the depth a of the penetration electrode hole 75a by a micro loading effect, so that the engaging hole 76 can be prevented from damaging a wiring layer 58.
申请公布号 JP6083315(B2) 申请公布日期 2017.02.22
申请号 JP20130098756 申请日期 2013.05.08
申请人 株式会社デンソー 发明人 山口 浩平;河口 昌源;橋本 浩嗣
分类号 G01L1/18;H01L29/84 主分类号 G01L1/18
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