| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that contact failure between a semiconductor and a heat dissipation case is likely to occur due to mounting variation in semiconductors thereby to reduce reliability when a plurality of heat generating semiconductor elements are mounted on a printed circuit board and generated heat by the heat generating semiconductor element is dissipated by contacting the heat generating semiconductor elements with the heat dissipation case.SOLUTION: By sandwiching a second semiconductor element between a first semiconductor element 1 and a heat dissipation plate 7 to form a semiconductor having an integrated structure of the first semiconductor element and the second semiconductor element and the heat dissipation plate obtained by using fixing means, heat dissipation of the first semiconductor element and the second semiconductor element is successfully performed thereby to prevent an adverse effect caused by heat of the semiconductor device. |
