OPTOELECTRONIC COMPONENT

摘要

The opto-electronic element has a metal core plate (5), a metal core (6), a dielectric layer (7) applied on the metal core and an electrically conductive layer (8) applied on the dielectric layer. The element also has a chip carrier (1) connected with the metal core plate and the chip carrier has a main surface (2) and another main surface (3). The chip carrier at the latter main surface is connected by a solder joint with the metal core of the metal core plate, where the dielectric layer and the electrically conductive layer are distant in the area of the solder joint from the metal core.