| 摘要 |
PROBLEM TO BE SOLVED: To provide an art for alleviating a stress by an encapsulation resin.SOLUTION: A semiconductor device manufacturing method comprises the steps of: setting a module 60 including a plurality of semiconductor chips 2 each having a surface 21 and a rear face 22 located on the opposite side to the surface, a surface-side heat sink 31 which is bonded to the surface via a solder 7 and has a through hole 30 formed to pierce from the surface to the rear face and a rear face-side heat sink 32 bonded to the rear face 22 via the solder 7, in a molding die 100; and embedding an encapsulation resin 5 between the surface-side heat sink 31 and the rear face-side heat sink 32 of the module 60 set in the molding die 100 to encapsulate the semiconductor chips 2. The molding die 100 includes a projection 103. In the setting step, the module 60 is set in a manner such that the projection 103 is inserted in the through hole 30 and a tip 113 of the projection 103 is arranged between two neighboring semiconductor chips 2 and between the surface-side heat sink 31 and the rear face-side heat sink 32 to form a gap 151 between the tip 113 and the rear face-side heat sink 32. |
