发明名称 |
CHIP ON CHIP ATTACH (PASSIVE IPD AND PMIC) FLIP CHIP BGA USING NEW CAVITY BGA SUBSTRATE |
摘要 |
An integrated passive device and power management integrated circuit are directly connected, active surface to active surface, resulting in a pyramid die stack. The die stack is flip-chip attached to a laminate substrate having a cavity drilled therein wherein the smaller die fits into the cavity. The die to die attach is not limited to IPD and PMIC and can be used for other die types as required. |
申请公布号 |
EP3133645(A1) |
申请公布日期 |
2017.02.22 |
申请号 |
EP20160188226 |
申请日期 |
2013.03.04 |
申请人 |
Dialog Semiconductor GmbH |
发明人 |
IAN, Kent |
分类号 |
H01L25/065;H01L23/13;H01L25/16 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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