| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a three-dimensional electronic circuit having a pop-up structure, on demand, at a low cost.SOLUTION: The method of manufacturing a three-dimensional electronic circuit includes a conductor patterning step (S101) for patterning a conductive material on a substrate, a component mounting step (S102) for mounting electronic components on the substrate, a substrate processing step (S103) for cutting the substrate, and a substrate deformation step (S104) for bending the substrate, while including the cutting position by the substrate processing step (S103), so as to displace at least one of the electronic components from the position on a plane to an arbitrary position of the substrate in the vertical direction. |
