低誘電性樹脂基材用処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板,申请号JP20150149642-传众专利搜索

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发明名称	低誘電性樹脂基材用処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板
摘要
申请公布号	JP6083619(B2)	申请公布日期	2017.02.22
申请号	JP20150149642	申请日期	2015.07.29
申请人	福田金属箔粉工業株式会社	发明人	岡本健;真鍋久徳
分类号	C25D7/06	主分类号	C25D7/06
代理机构		代理人
主权项
地址

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