| 发明名称 | Method of bonding two substrates and device manufactured thereby | ||
| 摘要 | The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer. | ||
| 申请公布号 | US9573804(B2) | 申请公布日期 | 2017.02.21 |
| 申请号 | US201214361683 | 申请日期 | 2012.12.21 |
| 申请人 | Micronit Microfluidics B.V. | 发明人 | Van 'T Oever Ronny;Blom Marko Theodoor;Haneveld Jeroen;Oonk Johannes;Olde Riekerink Marinus Bernardus;Tijssen Peter;Tigelaar Hendrik Jan Hildebrand;Fehr Jean-Noël;Roulet Jean-Christophe;Gupta Amitava |
| 分类号 | B81C1/00;H01L23/10;H01L21/50;B81C3/00;C23F1/02 | 主分类号 | B81C1/00 |
| 代理机构 | Bozicevic, Field & Francis LLP | 代理人 | Ng Rudy J.;Field Bret E.;Bozicevic, Field & Francis LLP |
| 主权项 | 1. A method for bonding at least two substrates using an intermediate metal film for providing the bonding, said method comprising the following steps of: a) providing said two substrates, wherein at least one substrate comprises glass, silicon, ceramic or a combination thereof; b) depositing said metal film on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said metal film on said surface of the first substrate such that an initial bonding between the second substrate and the metal film on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the metal film on the first substrate; wherein the method further comprises a step of cleaning the first substrate and/or the second substrate at least previous to step (b) and/or step (c) in order to enhance the strength of said initial bond between the second substrate and the metal film on the first substrate. | ||
| 地址 | Enschede NL | ||