Low profile leaded semiconductor package

摘要

In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.

主权项

1. A semiconductor package comprising:
a plastic body, the plastic body having a side surface; a semiconductor die; and a lead partially encased in the plastic body, the lead comprising a vertical column segment and a foot, the foot projecting horizontally outward at a bottom of the vertical column segment and protruding outward from a bottom of the side surface of the plastic body, the vertical column segment forming fight angles and sharp corners with the foot.