Method for manufacturing of printed product micro features and arrangement for continuous production of such a product

摘要

A method for manufacturing a printed product comprises provision (210) of a matrix comprising a matrix surface having a plurality of recesses. A first curable compound is applied (212) to the matrix surface to fill the recesses with the compound. The matrix surface and the filled recesses are covered (220) by a pickup layer of a second curable compound. The matrix is brought (230) in contact with the substrate surface and the first curable compound and the second curable compound are cured (232). The matrix surface is separated (234) from the substrate surface, leaving the pickup layer and the first curable compound on the substrate surface. The pickup layer and the first curable compound are thus transferred (240) together from the matrix surface onto a substrate surface of a substrate sheet. The first curable compound forms printed product micro features at the pickup layer covering the substrate surface.

主权项

1. A method for manufacturing a printed product, comprising the steps of:
a) providing a matrix comprising a matrix surface having a plurality of recesses; and b) applying a first curable compound to said matrix surface and said recesses so as to fill said recesses with said first curable compound; c) covering said matrix surface and said recesses filled with said first curable compound by a pickup layer of a second curable compound; d) bringing said matrix in contact with a substrate surface of a substrate sheet; e) curing, at least partly, said first curable compound and said second curable compound; and f) separating said matrix surface from said substrate surface, leaving said pickup layer and said first curable compound on said substrate surface; wherein said pickup layer and said first curable compound filling said recesses are transferred together from said matrix surface onto said substrate surface; and wherein said first curable compound forms printed product micro features at said pickup layer covering said substrate surface.