发明名称 |
Computer program product and method of controlling polishing of a substrate |
摘要 |
A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference spectrum, the metal reference spectrum being a spectrum of light reflected from a same metal material as the metal layer; measuring a sequence of raw spectra of light reflected from the substrate during polishing with an in-situ optical monitoring system; normalizing each raw spectrum in the sequence of spectra to generate a sequence of normalized spectra, of which normalizing includes a division operation where the measured spectrum is in the numerator and the metal reference spectrum is in the denominator; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra. |
申请公布号 |
US9573242(B2) |
申请公布日期 |
2017.02.21 |
申请号 |
US201414299728 |
申请日期 |
2014.06.09 |
申请人 |
Applied Materials, Inc. |
发明人 |
David Jeffrey Drue |
分类号 |
B24B37/013;B24B37/005;H01L21/304;B24B49/12;B24B49/04;G05B15/02;B24B37/04;B24B37/10;G01B11/06;G01J3/28;G01N21/55;G01N21/95;G01N21/84;H01L21/321 |
主分类号 |
B24B37/013 |
代理机构 |
Fish & Richardson P.C. |
代理人 |
Fish & Richardson P.C. |
主权项 |
1. A computer program product for controlling polishing, the computer program product tangibly embodied in a non-transitory computer readable medium and comprising instructions to cause a processor to:
receive from an in-situ optical monitoring system, during polishing of a substrate that includes a non-metallic first layer undergoing polishing, a semiconductor second layer, and a third layer between the non-metallic first layer and the semiconductor second layer, a sequence of raw spectra of light reflected from the substrate; store a reference spectrum, the reference spectrum being a spectrum of light reflected from a same material as the third layer; normalize each raw spectrum in the sequence of raw spectra to generate a sequence of normalized spectra, wherein the instructions to normalize include a division operation in which the raw spectrum is in the numerator and the reference spectrum is in the denominator; and determine at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra. |
地址 |
Santa Clara CA US |