| 发明名称 | Composition for printing and printing method using the same | ||
| 摘要 | Provided are a composition for printing for use in a printing method which uses a silicon-based blanket, including: 1) a binder resin, 2) a low boiling point solvent having a boiling point of less than 100° C., 3) a medium boiling point solvent having a boiling point of 100° C. or more and less than 180° C., and 4) a high boiling point solvent having a boiling point of 180° C. or more, wherein the medium boiling point solvent and the high-boiling solvent have a difference in solubility parameter with the binder resin of 3 (cal·cm)1/2 or less, a difference in solubility parameter with the silicon-based blanket of 4 (cal·cm)1/2 or more, and a swelling parameter for the silicon-based blanket of 2 or less, and a printing method using the same. | ||
| 申请公布号 | US9574095(B2) | 申请公布日期 | 2017.02.21 |
| 申请号 | US201214009756 | 申请日期 | 2012.04.05 |
| 申请人 | LG CHEM, LTD. | 发明人 | Son Yong Goo;Hwang Ji Young;Koo Beom Mo;Hwang In-Seok;Lee Seung Heon;Chun Sang Ki;Seong Jiehyun;Kim Joo Yeon |
| 分类号 | B41M3/00;C09D11/102;C09D7/00;C09D11/033;B41M1/06;C09D11/103;H05K3/00;H05K3/06 | 主分类号 | B41M3/00 |
| 代理机构 | Dentons US LLP | 代理人 | Dentons US LLP |
| 主权项 | 1. A reverse offset printing composition, which is applied on a silicon-based blanket, comprising: 1) a binder resin, 2) a low boiling point solvent having a boiling point of less than 100° C., 3) a medium boiling point solvent having a boiling point of 100° C. or more and less than 180° C., and 4) a high boiling point solvent having a boiling point of 180° C. or more, wherein the low boiling point solvent and the high boiling point solvent have a solubility parameter difference of 3 (cal·cm)½ or less with the binder resin and 4 (cal·cm)½ or more with the silicon-based blanket, and a swelling parameter of 2 or less for the silicon-based blanket. | ||
| 地址 | Seoul KR | ||