Pre-molded MEMS device package having conductive column coupled to leadframe and cover

摘要

A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection from a partially encapsulated lead frame to the conductive cover. Some embodiments may include a multi-tiered cavity within the mold body for mounting an integrated circuit separated by a gap above the MEMS device.

主权项

1. A method of packaging comprising:
installing a MEMS device in a mold body; adding conductive material to form a conductive column extending from a lead frame to an integrated circuit situated above the MEMS device and below a conductive cover; using the mold body, partially encapsulating the lead frame with an interior window area in a cavity to expose a die-bonding area; physically coupling the conductive cover to the mold body to form a package; using the cavity, forming an enclosed chamber within the package; and physically and electrically coupling the lead frame to the conductive cover.