Adhesive film and method of encapsulating organic electronic device

摘要

Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130° C. of 101 to 106 Pa·s and a viscosity at room temperature of 106 Pa·s or more in an uncured state, and when the adhesive layer has a multilayered structure, a difference in melting viscosity between layers is less than 30 Pa·s. In addition, the method of encapsulating an organic electronic device using the adhesive film is provided.

主权项

1. An adhesive film encapsulating an organic electronic device, comprising:
an adhesive layer comprising a curable resin and a moisture adsorbent, wherein the adhesive layer has a viscosity of 101 to 106 Pa·s at any one temperature point in the range of 30 to 130° C., and a viscosity of 106 Pa·s or more at any one room temperature point in the range of 15 to 35° C. when the adhesive layer is in an uncured state, wherein the adhesive layer is composed of at least two sub-adhesive layers, and a difference in viscosity between the sub-adhesive layers at any one temperature point in the range of 30 to 130° C. in an uncured state is less than 30 Pa·s, and wherein at least one sub-adhesive layer comprises the moisture adsorbent, at least one sub-adhesive layer does not comprise the moisture adsorbent, and the sub-adhesive layer which does not comprise the moisture adsorbent encapsulates an entire surface of the organic electronic device.