发明名称 Light emission device and illumination device
摘要 A light emission device includes: an insulating substrate; a light emitting section including a plurality of LED chips mounted on the insulating substrate; and land electrodes for supplying power to the LED chips. At least a surface of each of the land electrodes is made of a conductive material which is harder than Au and Ag and which has sulfurization resistance to such an extent that secures conduction of each land electrode when a current in a working current range is applied on the land electrode.
申请公布号 US9577153(B2) 申请公布日期 2017.02.21
申请号 US201314376578 申请日期 2013.02.19
申请人 Sharp Kabushiki Kaisha 发明人 Agatani Makoto;Matsuda Makoto
分类号 H01L33/40;H01L33/62;H01L25/075 主分类号 H01L33/40
代理机构 Nixon & Vanderhye P.C. 代理人 Nixon & Vanderhye P.C.
主权项 1. A light emission device, comprising: an insulating substrate; a semiconductor light emitting element mounted on the insulating substrate; and electrodes and outgoing wirings on the insulating substrate, the electrodes and the outgoing wirings each being for supplying power to the semiconductor light emitting element, each of the electrodes and the outgoing wirings including a first layer on the insulating substrate, each of the electrodes being configured such that a second layer is provided on the first layer, the first layer being provided integrally with the outgoing wirings, the first layer and the outgoing wiring comprising a first conductive material with low electric resistance, the second layer comprising a second conductive material which is harder than the first layer and which has sulfurization resistance to such an extent that secures conduction of said each electrode when a current in a working current range is applied on said each electrode, wherein the second layer comprises AgPd containing 30% or more by weight but 40% or less by weight of Pd; the second layer shielding only a part of the first layer from outside air by covering the part, the part of the first layer forming each of the electrodes, and a part of the outgoing wirings being exposed to the outside air, the part of the outgoing wirings not facing the insulating substrate.
地址 Osaka JP