Heat-dissipation structure and electronic device using the same

摘要

A heat-dissipation structure includes a first carbon nanotube layer and a thermal interface material layer. The first carbon nanotube layer and the thermal interface material layer are stacked on each other. The first carbon nanotube layer includes at least one first carbon nanotube paper, and the density of the first carbon nanotube paper ranges from about 0.3 g/cm3 to about 1.4 g/cm3. An electronic device applying the heat-dissipation structure is also disclosed.

主权项

1. An electronic device comprising:
at least one heat source; a heat-dissipation structure contacting the at least one heat source, wherein the heat-dissipation structure comprises a first carbon nanotube layer comprising a plurality of stacked carbon nanotube papers comprising a plurality of first carbon nanotubes substantially parallel to each other, and a density of each of the plurality of stacked carbon nanotube papers ranges from about 0.3 g/cm3 to about 1.4 g/cm3; and a heat-conducting structure comprising a metal core and a second carbon nanotube layer located on the metal core, and the second carbon nanotube layer comprising a plurality of second carbon nanotubes that extend along an axial direction of the heat-conducting structure.