Light emitting chip

摘要

A light emitting chip includes a light emitting unit, a eutectic layer and a surface passivation layer. The eutectic layer has a first surface and a second surface opposite to each other. The light emitting chip connects to the first surface of the eutectic layer. The surface passivation layer covers the second surface of the eutectic layer. A material of the surface passivation layer includes at least a metal of an oxidation potential from −0.2 volts to −1.8 volts.

主权项

1. A light emitting chip adapted to be electrically connected to an external substrate and comprising:
a light emitting unit, comprising first electrode and a second electrode; at least one eutectic layer, electrically connected to at least one of the first electrode and the second electrode; and a surface passivation layer, covering the at least one eutectic layer, wherein the surface passivation layer is located between and connects the at least one eutectic layer and the external substrate.