发明名称 Compound machining method and apparatus
摘要 A method of machining a workpiece may include continuously rotating the workpiece, continuously rotating a tool having at least one cutting surface, and positioning the tool relative to the workpiece so that the at least one cutting surface engages the workpiece at a first discrete location at a periphery of the workpiece. The method may further include continuing to rotate the workpiece and the tool so that the at least one cutting surface engages a second discrete location at the periphery of the workpiece, and controlling a tool surface velocity VT relative to the workpiece surface velocity VW so that the first and second discrete locations are discontinuous. The tool may make multiple iterative passes over the workpiece to engage subsequent discrete locations, wherein the first discrete location, second discrete location, and multiple subsequent discrete locations may form a machined surface that extends continuously around the workpiece.
申请公布号 US9575485(B2) 申请公布日期 2017.02.21
申请号 US201113290901 申请日期 2011.11.07
申请人 MORI SEIKI CO., LTD. 发明人 Hyatt Gregory A.;Chaphalkar Nitin
分类号 B23C3/00;B23B3/22;B23Q27/00;G05B19/4093 主分类号 B23C3/00
代理机构 Miller, Matthias & Hull LLP 代理人 Miller, Matthias & Hull LLP
主权项 1. A method of machining a workpiece comprising: rotating the workpiece around a workpiece axis and at a workpiece rotational speed NW so that a point on a periphery of the workpiece has a workpiece surface velocity VW; rotating a tool having at least one cutting surface around a tool axis and at a tool rotational speed NT so that the at least one cutting surface has a tool surface velocity VT; positioning the tool axis at a fixed location relative to the workpiece axis so that the at least one cutting surface engages the workpiece at multiple circumferential locations around the periphery of the workpiece as the tool and workpiece are rotated, wherein, with the tool axis at the fixed location, the workpiece and the tool are rotated for a sufficient duration so that the tool traverses multiple rotational passes around the periphery of the workpiece while the workpiece and the tool engage at the multiple circumferential locations; controlling the tool surface velocity VT relative to the workpiece surface velocity VW so that the circumferential locations for each of the rotational passes around the periphery of the workpiece are discrete and discontinuous; and controlling the workpiece rotational speed NW and the tool rotational speed NT so that a ratio of the workpiece rotational speed NW to the tool rotational speed NT is a non-integer selected such that none of the circumferential locations are repeated during the multiple rotational passes.
地址 Nara JP