Semiconductor device and fabrication method thereof

摘要

A semiconductor device includes a gate electrode formed on a silicon substrate via a gate insulation film in correspondence to a channel region, source and drain regions of a p-type diffusion region formed in the silicon substrate at respective outer sides of sidewall insulation films of the gate electrode, and a pair of SiGe mixed crystal regions formed in the silicon substrate at respective outer sides of the sidewall insulation films in epitaxial relationship to the silicon substrate, the SiGe mixed crystal regions being defined by respective sidewall surfaces facing with each other, wherein, in each of the SiGe mixed crystal regions, the sidewall surface is defined by a plurality of facets forming respective, mutually different angles with respect to a principal surface of the silicon substrate.

主权项

1. A semiconductor device comprising:
a silicon substrate; a gate insulating film over the silicon substrate; a gate electrode formed over the gate insulating film; a source region and a drain region formed in the silicon substrate; a first SiGe mixed crystal region formed in the source region; a second SiGe mixed crystal region formed in the drain region; a first silicide layer over the first SiGe mixed crystal region; a second silicide layer over the second SiGe mixed crystal region; a first sidewall insulating film formed on a first side wall of the gate electrode; and a second sidewall insulating film formed on a second side wall of the gate electrode, wherein a bottom of the first silicide layer and a bottom of the second silicide layer are located higher than a first boundary between the silicon substrate and the gate insulating film, each of the first and second SiGe mixed crystal regions includes a first side surface, a second side surface and a bottom surface, the second side surface is located upper than the first side surface, an angle of the first side surface from the bottom surface is 40 degree to 60 degree, an angle of the second side surface from the bottom surface is 90 degree to 150 degree, the first SiGe mixed crystal region includes a first portion that has Ge concentration of 0 to 20 atomic percent, and the second SiGe mixed crystal region includes a second portion that has Ge concentration of 0 to 20 atomic percent.