Substrate structure and package structure using the same

摘要

A substrate structure is provided. The substrate structure includes a number of traces, a substrate core, a number of first metal tiles, a number of second metal tiles, a number of first electrically-functioning circuits, and a number of second electrically-functioning circuits. The substrate core has a first surface and a second surface opposite to the first surface. The traces, the first metal tiles, and the first electrically-functioning circuits are disposed on the first surface and add up to a first metal structure proportion, and the second metal tiles and the second electrically-functioning circuits are disposed on the second surface and add up to a second metal structure proportion. The difference between the first metal structure proportion and the second metal structure proportion is within 15%.

主权项

1. A substrate structure, comprising:
a substrate core having a first surface and a second surface opposite to the first surface; a plurality of traces disposed on the first surface; a plurality of first metal tiles to increase the strength of the substrate structure, wherein the first metal tiles are disposed on the first surface; a plurality of second metal tiles to increase the strength of the substrate structure, wherein the second metal tiles are disposed on the second surface; a plurality of first electrically-functioning circuits disposed on the first surface; and a plurality of second electrically-functioning circuits disposed on the second surface; wherein, the traces, the first electrically-functioning circuits, and the first metal tiles along the first surface add up to a first metal structure covering a first proportion of the first surface, the second electrically-functioning circuits and the second metal tiles along the second surface add up to a second metal structure covering a second proportion of the second surface, and a difference between the first proportion and the second proportion is within 15%.