发明名称 |
Heterostructure field-effect transistor |
摘要 |
Heterostructure field-effect transistor (HFET) having a channel layer, a barrier layer disposed on the channel layer, and a gate, source and drain electrodes disposed on the barrier layer, respectively, and corresponding fabrication methods are disclosed. The drain electrode includes a p-type semiconductor patterned structure and a raised drain section, the drain electrode includes a Schottky contact and an ohmic contact, the Schottky contact is formed between a top surface together with a side surface of p-type semiconductor patterned structure and a bottom surface together with a side surface of raised drain section, the ohmic contact is formed between another surface of raised drain section and barrier layer, the raised drain section partially surrounding the p-type semiconductor patterned structure, and a bandgap of the channel layer is less than a bandgap of the barrier layer. |
申请公布号 |
US9577048(B1) |
申请公布日期 |
2017.02.21 |
申请号 |
US201514864680 |
申请日期 |
2015.09.24 |
申请人 |
EPISTAR CORPORATION |
发明人 |
Yang Ya-Yu;Lin Ping-Hao |
分类号 |
H01L21/00;H01L29/205;H01L29/778;H01L29/417;H01L29/66;H01L21/31;H01L21/02;H01L21/283;H01L21/308;H01L29/20;H01L21/311;H01L21/306 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
Tan Ding Yu |
主权项 |
1. A heterostructure field-effect transistor (HFET), comprising:
a substrate; a buffer layer disposed on the substrate; a channel layer disposed on the buffer layer and comprising a first group IIIA-VA compound semiconductor material; a barrier layer disposed on the channel layer and comprising a second group IIIA-VA compound semiconductor material; a gate disposed on the barrier layer; a source electrode; and a drain electrode, wherein the drain electrode includes a p-type semiconductor patterned structure and a raised drain section, the source electrode and the raised drain section are of the same metal material, the drain electrode includes a drain Schottky contact and a drain ohmic contact, the drain Schottky contact is formed between a top surface together with a side surface of the p-type semiconductor patterned structure and a first bottom surface together with a side surface of the raised drain section, the drain ohmic contact is formed between a second bottom surface of the raised drain section and the barrier layer, the raised drain section is partially surrounding the p-type semiconductor patterned structure, and a bandgap of the channel layer is less than a bandgap of the barrier layer. |
地址 |
Hsinchu TW |