Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil

摘要

Metal foil provided with an electrically resistive layer, characterized in that an alloy (in particular, a NiCrAlSi alloy) resistive layer containing 1 to 6 mass % of Si is formed on the metal foil controlled to have a ten-point average roughness Rz, which was measured by an optical method, of 4.0 to 6.0 μm, and the variation in the resistance value of the electrically resistive layer is within ±10%. Provided is a copper foil that allows embedding of a resistive material in a board by further forming an electrically resistive layer on the copper foil, and further allows improving the adhesiveness and suppressing the variation in resistance value within a certain range. As needed, metal foil provided in advance with a copper-zinc alloy layer formed on the surface thereof and a stabilizing layer composed of at least one component selected from zinc oxide, chromium oxide, and nickel oxide formed on the copper-zinc alloy layer is used.

主权项

1. Metal foil provided with an electrically resistive layer, characterized in that an alloy resistive layer containing 1 to 6 mass % of Si is formed on the metal foil controlled to have a ten-point average roughness Rz, which was measured by an optical method, of 4.0 to less than 6.0 μm, and the variation in the resistance value of the electrically resistive layer is within ±10%, wherein when a resin substrate is laminated to the metal foil provided with an electrically resistive layer, peel strength as received between the electrically resistive layer and the resin substrate is 0.60 kN/m or more.