Device comprising a ductile layer and method of making the same

摘要

Device comprising a ductile layer, a method for making a component comprising a ductile layer and a method for testing a component are disclosed. An embodiment includes an electronic device including a first conductive layer, a ductile layer and a brittle layer between the first conductive layer and the ductile layer.

主权项

1. A component comprising:
a substrate; a first metal line disposed over the substrate; an insulating layer disposed over the first metal line; a second metal line disposed over the insulating layer; a ductile metal layer disposed between the first metal line and the second metal line, wherein the ductile metal layer is composed of a different metal than the first metal line, and wherein the ductile metal layer comprises tin, indium, or undoped aluminum and the first metal line comprises copper; and a metal barrier layer disposed between the first metal line and the second metal line, wherein the metal barrier layer is disposed directly beneath the second metal line, wherein the ductile metal layer is disposed directly beneath the metal barrier layer, and wherein the insulating layer is disposed directly beneath the ductile metal layer.