Wafer or reticle thermal deformation measuring techniques

摘要

A system includes a wafer stage adapted to hold a semiconductor wafer thereon. A moveable temperature sensor array is configured to move to a plurality of different positions over a surface of the wafer stage and to take a plurality of temperature measurements at the plurality of positions, respectively. Based on the plurality of temperature measurements, a controller is adapted to determine an expected thermal deformation for the semiconductor wafer or for a reticle arranged over the semiconductor wafer.

主权项

1. A system, comprising:
a wafer stage adapted to hold a semiconductor wafer thereon; a first pair of parallel rails which extend over the wafer stage; a mounting element that engages the first pair of parallel rails and which is configured to move between a plurality of different positions along the first pair of parallel rails; a moveable array of temperature sensors mounted on the mounting element and configured to take a plurality of temperature measurements at the plurality of different positions, respectively; and a controller adapted to direct the mounting element to move between the plurality of different positions and to direct the moveable array of temperature sensors to take the plurality of temperature measurements, wherein the controller is further adapted to, based on the plurality of temperature measurements, determine an expected thermal deformation for the semiconductor wafer or for a reticle arranged over the semiconductor wafer.