HIGH DYNAMIC TEMPERATURE CONTROL SYSTEM

摘要

The major problems in a typical variothermal molding system using a transfer medium include low dynamic molding cycles, inefficient use of energy, absence of temperature selectivity on the mold surfaces, absence of temperature separation between cavity and rest of the molding tool. The present invention relates to a heating/cooling module for a molding system and for heating and cooling a target. The heating/cooling module comprises a substrate including a mold surface, the mold surface defining a part of a mold cavity; a cooling unit disposed adjacent to the mold surface for cooling the mold surface; and a layered heater directly formed on the cooling unit or the substrate by thermal spraying for heating the mold surface.