Circuit board structure and method for manufacturing the same

摘要

A method for manufacturing a circuit board structure is provided. First, a first circuit layer is formed on a carrier. Then, a first dielectric layer is formed on the carrier and the first circuit layer. Thereafter, at least one first hole is formed in the first dielectric layer to expose a portion of the first circuit layer. Then, a second dielectric layer is formed on the first dielectric layer and the first circuit layer. Thereafter, at least one trench and at least one second hole are formed in the second dielectric layer, in which the trench exposes a portion of the first dielectric layer, and the second hole exposes the portion of the first circuit layer. The second hole is disposed in the first hole. Then, a metal layer is formed to fill the trench and the second hole.

主权项

1. A circuit board structure, comprising:
a first circuit layer; a first dielectric layer disposed on the first circuit layer, wherein the first dielectric layer has at least one first hole exposing a portion of the first circuit layer; a second dielectric layer disposed on the first circuit layer and the first dielectric layer, wherein the second dielectric layer has at least one trench and at least one second hole disposed in the first hole, the second hole exposing the first circuit layer, the trench exposing the first dielectric layer; a second circuit layer disposed in the trench; and a conductive via disposed in the second hole without contacting the first hole, wherein a diameter of the second hole is smaller than a diameter of the first hole, and the conductive via has a bottom surface, a top surface, and a side surface connecting the bottom surface and the top surface.